A. Equipment overview
A ye tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ. Kɔn looi tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈ A ye tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ t Ka tɛmɛ kɔnɔ, ka tɛmɛ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ kɔnɔ.
II. Luɔi
A tɛmɛ ne semiconductor wafer (photogravure glue PI, PBO curing), IC packaging (copper substrate, silver glue, silicon gel, epoxy resin), glass substrate baking, high precision annealing treatment etc.
| Application Range |
Ye bɛ̈ɛ̈i bɛ̈ɛ̈i bɛ̈ɛ̈i bɛ̈ɛ̈i bɛ̈ɛ̈i |
Warm object |
| Elektronik |
Degreasing (adhesive sintering), hardening |
Ceramic materials/sheets, MLCC (multi-layer ceramic capacitors), LTCC (low temperature co-burning ceramics), ceramic O2 sensors, ferrous oxide magnet cores, FPC (flexible printed circuit), common mode noise filters, thermostats |
| Raw materials Precision |
Degreasing, hardening, annealing, sintering, drying |
Wafers, silicon sheets, silicon carbide ceramics, electrostatic suction discs, aluminium nitride, optical lenses, flexible substrates, rechargeable batteries, electrode materials, wire bundles (copper wires), catalysts, forgings |
Third, Parameters of product (Parameters of product) (Parameters of product) (Parameters of product) (Parameters of product) (Parameters of product) (Parameters of product) (Parameters of product) (Parameters of product) (Parameters of product) (Parameters of product)
Model |
YH-OXY-500C |
Luɔi Stability Range |
Tɛmɛ <unk> 500 ℃ |
Oxygen Limit |
50 PPM |
Fɛɛr cooling |
Kɔl koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor koor |
Size | |||
Baara size |
H600*W600*D600mm |
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Studio | |||
Studio waa |
Studio tök, studio 4 |
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Configuration wɛɛngɛ |
Configure 4 stainless steel brackets, stainless steel mesh plate wrapped on the bracket, the bracket gap can be adjusted |
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Sisitɛm Heating | |||
Heating Rate |
Warming rate 8-10℃/min, thermostatic time can be controlled |
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Speed cooling |
500 ℃ cooling to 100 ℃ ≤ 50 minutes (depending on the cooling water temperature, the time is different) 500 ℃ cooling to 100 ℃ ≤ 50 minutes (depending on the cooling water temperature, the time is different) |
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Nitrogen laar |
Automatic control of nitrogen charging process, ensuring products are heated in an oxygen-free or low oxygen concentration environment, preventing product oxidation. Automatic control of nitrogen charging process, ensuring products are heated in an oxygen-free or low oxygen concentration environment, preventing product oxidation. |
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Elektrik | |||
Ajuiɛɛr de gël de température |
Independent smart thermostat, when real detection temperature exceeds the superheat protector set value, automatically cutting the heating power, double protection function |
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Sistem gël |
Equipment has missing phase detection, self-diagnosis, leakage protection, overheating protection, emergency parameters self-storage, sensor self-diagnosis, overload protection, ground protection, fan overheating protection, battery access control, operator anti-stay setting protection |
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Luɔi Environment |
Tɛmɛ: 5 ~ 40 ° C: Humidity ≤ 85% R.H 电源: AC380V, 50HZ Luɔi: No vibration strong, no magnetic field influence strong, no corrosion gas, no dust. Pɛɛr 86~106Ka Nitrogen: 0.8MPA, 100L/MIN Distance wall ≥500mm |
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