LED Bracket Plasma Washing Machine TS-VPL150 Parameters of Product:

LED Bracket Plasma Washing Machine Product Description:

LED StandPlasma cleaning machine consists of vacuum room, vacuum pump group, power supply, gas supply device and control parts (including vacuum control, power control, temperature control, gas flow control, etc.); ye cɔl vacuum room, vacuum pump group, power supply, gas supply device and control parts (including vacuum control, power control, temperature control, gas flow control, etc.); ye cɔl vacuum room, vacuum pump group, power supply, gas supply device and control parts Ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka Plasma cleaning belongs to dry method cleaning, with a good cleaning effect, easy operation (saving wet method cleaning drying link), exhaust gas treatment simple advantages, widely used in semiconductor wafer manufacturing, semiconductor testing, semiconductor packaging. Plasma cleaning belongs to dry method cleaning, with a good cleaning effect, easy operation (saving wet method cleaning drying link), easy advantages of exhaust gas treatment, widely used in semiconductor wafer manufacturing, semiconductor testing, semiconductor packaging.LEDAjuiɛɛr ye cɔl packaging and vacuum electronics, connectors and relays.

Plasma washing machine ye luɔ̈ɔ̈i në LED packaging:

LEDKɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ A sɔrɔ ka tɛmɛ plasma saniya ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ Kä kɔ̈k wɛ̈t bɛ̈n looi bɛ̈n looi bɛ̈n looi bɛ̈n looi bɛ̈n looi bɛ̈n looi bɛ̈n looi.

LEDKä ye kɔrɔ në luɔɔi:

(1)LEDKɛnɛya dɔ̈ŋ ye kɛ̈ɛ̈k ye kɛ̈ɛ̈k ye kɛ̈ɛ̈k ye kɛ̈ɛ̈k ye kɛ̈ɛ̈k ye.

(2)Kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl ye kɔl,Na cï kaam juëc tɔ̈ɔ̈u thïn, fiɲɛ̈ɛ̈r bɛ̈n lɔ̈ɔ̈m ku bɛ̈n lɔ̈ɔ̈m ku bɛ̈n lɔ̈ɔ̈m.

Solution ye:

(1)Kaŋ silver glue. Kä ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ ye kɔnɔ,Not good for chip paste,Ku a lëu bï chip ya cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk cɔk,Lɔ̈ɔ̈i de RF plasma bï kä ye kek looi ya cɔk tɔ̈ɔ̈u ku bï kä ye kek looi ya cɔk tɔ̈ɔ̈u ku bï kä ye kek looi ya cɔk tɔ̈ɔ̈u,Aye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n ye kɛ̈n,A bɛ se ka tɔ̈u ka tɔ̈u ka tɔ̈u ka tɔ̈u ka tɔ̈u ka tɔ̈u ka tɔ̈u ka tɔ̈u ka tɔ̈u,Lɔ̈k wëu.

(2)Kawɛ lead bind. Na cï chip tääu në substrate,Ka tɛmɛ ka tɛmɛ,Kä ye kek tɔ̈ɔ̈u thïn alëu bï ya tɔ̈ɔ̈u thïn ka tɔ̈ɔ̈u thïn ka tɔ̈ɔ̈u thïn ka tɔ̈ɔ̈u thïn,Kä ye kek tɛ̈ɛ̈r ye kek tɛ̈ɛ̈r ye kek tɛ̈ɛ̈r ye kek tɛ̈ɛ̈r ye kek tɛ̈ɛ̈r ye kek tɛ̈ɛ̈r,A kɛ sabab ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye. Radiofrequency plasma cleansing ka tɛmɛ lead bonding,A bɛ baara kɛnɛma dɔ'a juak,O ye kɛ sababu ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye. Pressure of binding knife head can be low(Ni awo ye kɔnɔ,Binding heads to penetrate pollutants (Binding heads to penetrate pollutants) (Binding heads to penetrate pollutants) (Binding heads to penetrate pollutants) (Binding heads to penetrate pollutants),Aw bɛ pressure kɛrɛnkɛrɛnnen),Kawɛ laan,A lëu bï tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ,O kɔrɔ, ka baara juak,Lɔ̈k wëu.

(3)LEDKadu ka gɛl. HaLEDEpoxy resin glue luɔɔi,Kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ ye kɔnɔŋ,Ku yen bɛ kɛ̈ɛ̈l ye kɛ̈ɛ̈l ye kɛ̈ɛ̈l ye kɛ̈ɛ̈l ye kɛ̈ɛ̈l,O majaw,Ye raan dɛ̈t ye raan dɛ̈t ye raan dɛ̈t ye raan dɛ̈t ye raan dɛ̈t ye raan dɛ̈t ye raan dɛ̈t ye raan dɛ̈ Ka tɛmɛ radiofrequency plasma,Chips ku substrate bɛ̈n mat kek colloids,Bubbles bɛ dɔɔr dɔɔr,Aye dɛ̈t peei, a bɛ̈n ya juak apɛi në tɛ̈n yenë kɔc cɔl thermal dissipation ku jɔl ya tɛ̈n yenë kɔc cɔl light emission.