Low temperature plasma surface treatment equipment consists of vacuum cavity and high frequency plasma power supply, pumping vacuum system, inflation system, automatic control system and other parts. Kuen ye kɔc cɔl vacuum cavity, ye kɔc cɔl high frequency plasma power supply, ye kɔc cɔl high frequency plasma power supply, ye kɔc cɔl high frequency plasma power supply Bɛ̈n. Ajuiɛɛr de luɔɔi ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tɛ̈n ye tKa tɛmɛ pomp de vacuum, ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔnɔ ka tɛmɛ kɔn Kä ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ̈k ye kɛ

Parameters teknis

1Dimensions of equipment: 450mm*400mm*240mm

2Dimensions of vacuum warehouse: Φ151×300(L)mm （5L）

3.Struktur depot: Stainless steel cavity, built-in capacitive coupling electrode, no pollution, built-in quartz tray.

4.Plasma generatorRadio frequency, power 0-300W adjustable, full circuit protection, continuous long time work (air cooling). Radio frequency, power 0-300W adjustable, full circuit protection, continuous long time work (air cooling). Radio frequency, power 0-300W adjustable, full circuit protection, continuous long time work (air cooling).

5Sistem Kontrol: PLC touch screen full automatic control, using Omron, Schneider and other imported brand electrical components, there are manual, automatic two control modes, true color desk to touch screen, Siemens programmable controller (PLC), American production vacuum pressure sensing system, can set up, modify, monitor vacuum pressure, processing time, plasma power and other process parameters, and has failure alarm, process storage and other various functions. Ka tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛmɛ tɛ Manual mode ee luɔɔi kɛ luɔɔi ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r ye kɛ̈ɛ̈r

Proses:

1Process Processing Load workpiece→ Pumping vacuum → Pumping into reaction gas → Plasma discharge treatment → Gas bouncing → Take out workpieces

2Process Control:

2.1 Ajuiɛɛr ye looi: 1 sekond ka tɛmɛ 120 minit ka tɛmɛ.

2.2 Plasma discharge pressure: 30 ~ 50Pa.

2.3 Power setting range: 0~300W continuously adjustable.

2.4 Lɔ̈ɔ̈m ye looi: Gas 1 (0 ~ 300ml/min) Gas 2 (0 ~ 500ml/min).

PLC software function (control interface)

Main screen: real-time monitoring and displaying operation status and data, plasma power supply power, gas flow, valve switch, vacuum pressure, Wakt lui, etc.

Parameters Setting: You can set, modify process parameters and steps. Parameters Setting: You can set, modify process parameters and steps. Parameters Setting: You can set, modify process parameters and steps.

Tɛ̈n yenë yen luui thïn: A lëu ba data ku tɛ̈n yenë yen luui thïn ya tïŋ online.

Alarms of failure: various failure detection, alarms and interlocking protection (Alarms of failure, alarms and interlocking protection) Ye.

PDMS chip bonding app

PDMS kɛnɛ slide carrier

Ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛPDMS ka tɛ̈ɛ̈r ka tɛ̈ɛ̈r ka tɛ̈ɛ̈r ka tɛ̈ɛ̈r ka tɛ̈ɛ̈r ka tɛ̈ɛ̈r ka tɛ̈ɛ̈r ka tɛ̈ɛ Sistɛm kënë luɔɔi ye nɔgɔya, a tɛmɛ a yic, a tɛmɛ a yic, a tɛmɛ a yic, a tɛmɛ a yic, a tɛmɛ a yic, a tɛmɛ a yic, a tɛmɛ a yic.