Raan: 13.56MHz
Lööŋ: ISO/IEC 18000-3 15693
Chip type: NXP I CODE II (a lëu bï ya looi në kë wïc)
UID: 64 bit
Baara: 512bits
Tʋma distance:
Reading distance (handheld) Handheld reading distance: 2cm or more, handheld power: 0.25W (ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc ye kɔc
Reading distance (fixed type) Fixed reading distance: 4cm or more, fixed reader power: 1.5W. Reading distance (fixed type) Fixed reading distance: 4cm or more, fixed reader power: 1.5W. Reading distance (fixed type) Fixed reading distance: 4cm or more, fixed reader power: 1.5W.
Chip ye kɔn ku gɔ̈ɔ̈r: 100,000 cycle;
Application Case: RFID Technology Used for Intelligent Manufacturing Industrial Automation (RFID Technology Used for Intelligent Manufacturing Industrial Automation)
RFID High Frequency (HF) Industrial Anti-Metal Electronic Label Physical Properties
Size: Φ9mm*3mm (a lëu bï ya looi në size wɛ̈ɛ̈r cït a wïc);Kä ye kek tɔ̈ɔ̈u në ɣän kɔ̈k yiic: ɣän kɔ̈k yiic ka tɔ̈ɔ̈u në ɣän kɔ̈k yiic;
Label substrate: copper wire coil + PBT plastik;
Luɔr: Black;
Installation method: ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl;
Kuen tɛmɛ: -25 ~ 75 ℃;
Kä ye kek tɔ̈ɔ̈u: -30 ~ 95 ℃;

Kä ye kek looi: Teknoloji RFID ye kek looi në luɔɔi ye kek looi në luɔɔi ye kek looi
