Lööŋ: ISO/IEC 18000-3 15693
Chip type: NXP I CODE II (a lëu bï ya looi në kë wïc)
UID: 64 bit
Baara: 512bits
Tʋma distance:
Reading distance (handheld) Handheld reading distance: 4cm or more, handheld power: 0.25W. Read distance (handheld) Handheld reading distance: 4cm or more, handheld power: 0.25W. Read distance (handheld) Handheld reading distance: 4cm or more, handheld power: 0.25W.
Reading distance (fixed type) Fixed reading distance: 6cm or more, fixed reader power: 1.5W. Reading distance (fixed type) Fixed reading distance: 6cm or more, fixed reader power: 1.5W. Reading distance (fixed type) Fixed reading distance: 6cm or more, fixed reader power: 1.5W.
Chip ye kɔn ku gɔ̈ɔ̈r: 100,000 cycle;
Application Case: RFID Technology Used for Intelligent Manufacturing Industrial Automation (RFID Technology Used for Intelligent Manufacturing Industrial Automation)
Application Case: RFID Technology Used for Intelligent Manufacturing Industrial Automation (RFID Technology Used for Intelligent Manufacturing Industrial Automation)
RFID High Frequency (HF) Industrial Carrier Body Electronic Label Physical Properties
Size: Φ9mm*3mm (a lëu bï ya looi në size wɛ̈ɛ̈r cït a wïc);
Kä ye kek looi: Kä ye kek looi:Label substrate: copper wire coil + PBT plastik;
Luɔr: Black;
Installation method: ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl ye gɛl;
Kuen tɛmɛ: -25 ~ 75 ℃;
Kä ye kek tɔ̈ɔ̈u: -30 ~ 95 ℃;
Application Case: RFID Technology Used for Intelligent Manufacturing Industrial Automation (RFID Technology Used for Intelligent Manufacturing Industrial Automation)
Application Case: RFID Technology Used for Intelligent Manufacturing Industrial Automation (RFID Technology Used for Intelligent Manufacturing Industrial Automation)
