Član VIP
YSB55w
YSB55w ye baara kɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ ka tɛmɛ. "Semiconductor assembly revolution" looi
Detalji proizvoda
Description
Basic Specifications
| YSB55w | |||
|---|---|---|---|
| Object substrate | L240×W200～L50×W50mm | ||
| Thickness substrate | 0.2～3.0mm | ||
| Yɔɔr | Left → Right (Option: Right → Left) | ||
| Kɛnɛya kɛnɛya | ±5µm（3σ） | ||
| Kapasitet mounting | 13,000UPH (tɛ̈n tɛ̈n tɛ̈n tɛ̈n tɛ̈n tɛ̈n tɛ̈n tɛ̈n tɛ̈n tɛ̈n tɛ̈n | ||
| Kuen feeding form | 12 inch chip | ||
| Komponent Object | □2～30mm | ||
| Power Specifications | AC 200/208/220/240/380/400/416V ±10% 50/60Hz | ||
| Gas supply | 0.45Mpa ka nhial | ||
| Dimensions | L2,090×D1,866×H1,550mm (tɛ̈n yenë chip tääu thïn) | ||
| Weight ye | 3,500 kg (ye tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈n yenë tɛ̈ | ||
- Specifications, look and feel can be changed, without prior notice. Ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ.
Онлайн разпит
-
Kontakti
-
Kompanija
-
Telefon
-
E-mail
-
WeChat
-
Kod provjere
-
Сједност поруки
-