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YSH20
YSH20 High speed, high precision, reverse chip patcher mounting capacity up to 4,500UPH ((0.8 seconds/Unit), has the top-level mounting capacity in re
Detalji proizvoda
Description
Basic Specifications
| YSH20 | |
|---|---|
| Dimension substrate object |
L50 x W30 ～ L250 x W200 mm * L340 x W340 mm lëu bï ya kony. |
| Kuen feeding form | Chip (6/8/12 inch flat plate ring), cellular tray, material tape plate (width 8/12/16 mm) |
| Power Specifications | AC 200/208/220/240/380/400/416V: ±10% 50/60Hz |
| Gas supply | 0.5MPa ka nhial |
| Dimensions of appearance (excluding protruding parts) | L 1,400 x W1,820 x H1,515 mm L 1,400 x W2,035 x H1,515 mm (keke YWF chip supply device) |
| Weight ye | 2,470 kg (kɛ̈ɛ̈r dɔ̈ŋ) 2,780 kg (keke YWF chip supply device) |
- ※ Lëk wël kɔ̈k peei.
- Specifications, look and feel can be changed, without prior notice. Ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ, ka tɛmɛ.
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